| 发明名称 |
LEAD FRAME AND METHOD |
| 摘要 |
<p>An improved lead frame (10) and method as shown in Figs. 1 and 2 in which an adhesive tape strip (14) such as mylar is rolled or pressed along the lower face (26) of the lead frame (12) to contact the lead frame (12) lower face (26) and bonding pad (18) lower surface (30). Upon removal of the tags (20) retaining the individual circuit elements (18 and 32) to the lead frame (12), the parts are maintained in their existing orientation and position by the adhesive tape strip (14) in conjunction with the lead frame (12). The circuit elements (18 and 32) may then be handled as a unit by means of the lead frame (12)/adhesive tape strip (14) combination in subsequent testing, marking, lead bending or other handling operations.</p> |
| 申请公布号 |
WO8400444(A1) |
申请公布日期 |
1984.02.02 |
| 申请号 |
WO1983US00937 |
申请日期 |
1983.06.15 |
| 申请人 |
MOTOROLA, INC. |
发明人 |
JONES, RAYMOND, N.;LAWSON, JOHN, M.;KEIL, O&apos,DELL, F. |
| 分类号 |
H01L23/48;H01L21/60;H01L21/68;H01L23/495;H01L23/50;(IPC1-7):01L23/48;05K5/02 |
主分类号 |
H01L23/48 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
|
| 地址 |
|
