发明名称 SEMICONDUCTOR DEVICE
摘要 An IGFET assembly, includes a semiconductor substrate of a given first conductivity type having first and second surfaces, an IGFET having at least one channel zone of a second conductivity type opposite the first given conductivity type embedded in the first surface of the substrate, a source zone of the first conductivity type embedded planar in the channel zone, a drain zone adjacent the first surface of the substrate, a drain electrode connected to the second surface of the substrate, an insulating layer disposed on the first surface of the substrate, at least one gate electrode disposed on the insulating layer, at least one injector zone of the second conductivity type embedded in the first surface of the substrate, a contact for connecting the injector zone to a voltage source, an emitter zone of the first conductivity type embedded in the injector zone, the emitter zone having a heavier doping than the injector zone, the injector zone including a part thereof emerging to the first surface of the substrate, the drain zone having a part thereof emerging to the first surface of the substrate between the channel zone and the injector zone, the parts of the injector and drain zones emerging to the first surface of the substrate being covered by the gate electrode, and the injector zone having a surface and having a doping, at least at the surface thereof, forming a channel in the surface of the injector zone connecting the drain zone to the emitter zone when a voltage is present switching the IGFET into conduction.
申请公布号 JPS5921070(A) 申请公布日期 1984.02.02
申请号 JP19830119472 申请日期 1983.06.30
申请人 SIEMENS SCHUCKERTWERKE AG 发明人 HEMUUTO SHIYUTORATSUKU;IEENE TEIIHANII
分类号 H01L29/78;H01L21/331;H01L29/10;H01L29/73;H01L29/739 主分类号 H01L29/78
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