A process for coating a liquid photopolymerizable composition and a process for producing a printed circuit board thereby.

摘要

A process for coating a liquid photopolymerizable composition (1), wherein a substantially transparent carrier film (2) having flexibility is coated with the liquid photopolymerizable composition (1) to uniform thickness, then the carrier film (2) is transferred, and further the carrier film is pressed at predetermined pressure to a base material (6) in a state where the coated surface of the carrier film faces to the base material (6), thereby the liquid photopolymerizable composition (1) is uniformly coated on the base material (6) to predetermined thickness. By using the process, a photoresist, a printing circuit board and a solder mask can be produced.