发明名称 |
Coated ceramic substrates for mounting integrated circuits and methods of coating such substrates. |
摘要 |
<p>Coated ceramic substrates or structures having a barrier layer against alpha-particle radiation and integrated circuits prepared therefrom. Ceramic surfaces having reduced or modified surface roughness are also provided.</p><p>As shown in the Figure the ceramic substrate is coated with a layer of high purity ceramic before the metallization layer is deposited. An electronic chip is then flip bonded to the coated substrate. In one example the coating is formed by applying droplets of a mix comprising a surfactant and a colloidal dispersion of alumina to the substrate, spinning the substrate and then drying the spun layer. Thereafter the ceramic is fired e.g. at 850°C for 15 minutes.</p> |
申请公布号 |
EP0099570(A2) |
申请公布日期 |
1984.02.01 |
申请号 |
EP19830107059 |
申请日期 |
1983.07.19 |
申请人 |
INTERNATIONAL BUSINESS MACHINES CORPORATION;UNITED KINGDOM ATOMIC ENERGY AUTHORITY |
发明人 |
CAIRNS, JAMES ANTHONY;ZIEGLER, JAMES FRANCIS |
分类号 |
H01L23/02;H01L23/08;H01L23/15;H01L23/556;H05K1/03;H05K3/38;(IPC1-7):01L23/54;01L23/14 |
主分类号 |
H01L23/02 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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