| 摘要 |
<p>A polyamide acid in which 2-60% esp. 10-40% of the COOH gps. present are reacted with a mono-aminosilane (I) is claimed. (I) is pref. a cpd. (I) in which Alk is 1-4C alkyl, R1 is 1-3C alkoxy, 1-3C alkyl or benzyl, and R2 is -(CH2)m- in which m= 1-4, or p-C6H4-. Pref. polyamide acid has the formula (II) in which R3 is chosen from (III), (IV), (V), (VI) in which R5 is -(CH2)m-in which m= 1-4, -CO-, -O-, -SO-, -SO2- or -CONH- and R6 is H or -CONH2, R4 is (VII), (VIII) in which R7 is -(CH2)m- where m= 1-4, -CO-, -O-, -SO- and -SO2- and n is at least 15. (II) is reacted with (I) in organic solvent soln. to give the modified polyamide acid. When subjected to imidisation at elevated temps., the modified polyamide acids give polyimides with improved heat resistance and adhesion. The compsns. can be applied by spraying, casting or dipping to give coating or passivating layers in electronic components such as semiconductors, chips, ICs, printed circuits, electrical conductors, etc.</p> |
