发明名称 PRESSURE WITHSTANDING METHOD USING ADHESIVE
摘要 PURPOSE:To enable to impart pressure resistance to a member that has not been able to withstand pressure so far by conventional method, by eliminating influence of welding heat to the material and also eliminating the allowance required for imparting pressure resistance to the material by using an adhesive in a method of bonding a pressure withstanding blind patch. CONSTITUTION:A pressure withstanding blind patch 2 is bonded to a pressure withstanding material 1 by use of an adhesive 3. The adhesive 3 is applied to the contact surface of the pressure withstanding material 1 and the blind patch 2, and after they are bonded together, the adhesive 3 is further applied to the peripheral portion of the contact surface by padding. After use for pressure withstanding, the adhesive 3 is removed by dissolving it by use of the solution for the adhesive 3, or otherwise, by heating the bonded portion to about 200 deg.C. Here, the temperature of about 200 deg.C does not cause adverse influence to the material 1. Further, since the adhesive 3 is removed after use for pressure withstanding, the allowance for pressure withstanding is not required.
申请公布号 JPS5919775(A) 申请公布日期 1984.02.01
申请号 JP19820127718 申请日期 1982.07.23
申请人 HITACHI SEISAKUSHO KK 发明人 WATANABE YOSHIO;SHIMURA TAKAO
分类号 F16J15/04;G01N3/02;G01N3/04;G01N3/12 主分类号 F16J15/04
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