发明名称 APPARATUS FOR REMOVING RESIN BURR OF SEMICONDUCTOR
摘要 PURPOSE:To remove completely burr not accompanied by dust, by scanning the burr producing area with light to controllably drive an assembly holder and a rotary grinding wheel section on the basis of the scanning result. CONSTITUTION:A burr producing area 2a on a radiator plate 1b of a resin molded lead frame assembly 3 is scanned through light with the cooperation of a light emitter 15 and a light receiver 16 and the scanning result is supplied to the input of a control unit 17. On the basis of this result are controllably driven the reciprocating motion of an assembly holder 12 and the motion of a rotary grinding wheel 13 by the control unit 17. A lead frame assembly 1 inserted into the assembly holder 12 by an inserting mechanism 11 and held in a mold section 2 by pressure reduction and adsorption is longitudinally reciprocated and the rotary grinding wheel 13 is pressed against this reciprocating assembly 1 in the mold secdtion 2 by an predetermined pressure to removably grind the resin burr 2a.
申请公布号 JPS5919675(A) 申请公布日期 1984.02.01
申请号 JP19820129561 申请日期 1982.07.27
申请人 TOKYO SHIBAURA DENKI KK 发明人 SUGAWARA MOTOYUKI
分类号 B24B49/00;B29B7/00;B29C39/00;B29C39/28 主分类号 B24B49/00
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