| 摘要 |
PURPOSE:To perform ground connection of stable characteristic without the exfoliation of chips by a method wherein a ground pin lead whose top end is flat is extended to the chip containing part of a ceramic package, and then a semicondutor chip is fixed to the top end. CONSTITUTION:The leads 3 are so arranged that the top ends are extended from an outer frame 6 and gathered at the center. Of these leads, the top end of the lead 13 serving as a ground pin is particularly extended and flattened, then fitted into the bottom of a chip containing recess at the center of the ceramic package 2, and the semiconductor chip 1 is fixed to the top end. Since the entire body of the chip back surface is connected directly to the ground pin, electric characteristics are stabilized. Further, the chip containing cavity is covered with the top end of the ground pin, therefore, the coating of Au paste for adhering purpose is unnecessitated. |
