| 摘要 |
PURPOSE:To enable to operate a semiconductor device at a high speed by forming a control electrode lead of the device, on which a semiconductor element of flat package is mounted, in a plate shape, thereby facilitating desired inductance and resistance. CONSTITUTION:A semiconductor device 11 has opposing conductors 13a, 13b and an insulator case 16. A gate electrode plate leads 18 have a part 20 punched in a rectangular shape, and the device is disposed corresponding to the part 20. Many parallel bonding wiring leads 19 are electrically connected between the control electrode of the device 11 and four bonding wiring lead coupling parts disposed around the part 20. When such a structure is mounted on a wide conductor plate, the electrodes are composed in a transmission line structure. As a result, a current is dispersed, thereby reducing the inductance. |
