VERFAHREN ZUM BEFESTIGEN VON CHIP-ARTIGEN SCHALTUNGSELEMENTEN AUF EINER PLATTE FUER GEDRUCKTE SCHALTUNGEN SOWIE VORRICHTUNG ZUR DURCHFUEHRUNG DIESES VERFAHRENS.

摘要

A method whereby chip type circuit elements are mounted at predetermined locations on a printed circuit board by a suction means and apparatus for performing the method are disclosed. The suction means picks up each circuit element from a respective stack supported in a vertical magazine and transfers and positions them above the predetermined locations on the printed circuit board which can have a predetermined pattern of laminar conductors on the upper surface thereof. The circuit elements are then released by termination of the applied suction and adhered to the board by a thermoplastic adhesive setting operation.