| 摘要 |
PURPOSE:To enable to completely repair the chipping defect of a deposited chromium film by a method wherein, after the chipping defect of the chromium film has been exposed, an etching is slightly performed on the exposed part, and then a chromium film is deposited thereon. CONSTITUTION:A desired pattern is drawn on a metal chromium film 2 located on a glass substrate 1, and a chipping defect 3 comes into presence on a part of said film 2. A positive type resist 4 is applied on the whole surface, and after ultraviolet rays 5 radiate the chipping defect part 3 only, a developing process is performed, and the chipping defect part 3 alone is exposed from the resist 4. Then, an etching is lightly performed on the exposed part which is not covered by the resist 4. Subsequently, a metal chromium 6 is deposited on the whole mask. Lastly, the chromium 6 on the resist 4 is lifted off by exfoliating the resist 4, and the chromium 6 on the exposed part remains, thereby enabling to repair the chipping defect by the remaining chromium 6. |
