发明名称 ASSEMBLING METHOD FOR SOLID STATE IMAGE PICKUP DEVICE
摘要 PURPOSE:To shorten the bonding time of a solid state image pickup element and a color separation filter plate and to improve the positioning accuracy of a solid state image pickup device by providing a light or heat reactive adhesive between the solid state image pickup element and the color separation filter plate, positioning the image pickup element and the filter and then introducing a curing light to fix the adhesive. CONSTITUTION:A color filter 6 is attracted to a chuck 10 which has attraction ports 10a, 10b, an image pickup element 8 is secured to a package 9, and attracted to a base 11. Adhesive 7 which is cured by heat or light is interposed between the filter 6 and the element 8. After both are completely positioned, ultraviolet ray is introduced from a lamp 4 to an optical system, a spot is projected through a transparent reflecting mirror 3 and an objective lens 5 to the adhesive 6 to cure the adhesive, thereby securing several positions. Subsequently, it is completely fixed in a constant-temperature oven. According to this method, the positioning accuracy can be improved, and the mass productivity can be improved.
申请公布号 JPS5918673(A) 申请公布日期 1984.01.31
申请号 JP19820128113 申请日期 1982.07.21
申请人 MATSUSHITA DENKI SANGYO KK 发明人 HIRAMOTO MASAO;ISHIKAWA SEIJI
分类号 G02B5/20;H01L27/14;H01L31/0216;H04N9/07 主分类号 G02B5/20
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