发明名称 |
METHOD OF SAWING CRYSTALLINE RODS,AND MULTIPLE-BLADE INTERNALHOLE SAW FOR CARRYING OUT THE METHOD |
摘要 |
Crystalline rods or blocks can be sawed into thin wafers by sawing the rod or block into a plurality of wafers that are connected to each other. The wafers can be connected by introducing a connecting agent after each sawing step, into the resulting cutting gaps. The wafers are separated only after the whole rod has been sawed. The method makes possible the use of multiple-blade internal-hole saws, and preferably two-blade internal-hole saws. |
申请公布号 |
ZA8303025(B) |
申请公布日期 |
1984.01.25 |
申请号 |
ZA19830003025 |
申请日期 |
1983.04.29 |
申请人 |
WACKER-CHEMITRONIC GES FUER ELEKTRONIK-GRUNDSTOFFE MBH |
发明人 |
LOESSL GUENTER;ZAUHAR HELMUT;STOCK HORST |
分类号 |
B24B27/06;B23D59/00;B28D5/00;B28D5/02 |
主分类号 |
B24B27/06 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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