| 摘要 |
<p>PURPOSE:To reduce the size of a heat sink by forming the burr produced by pressing in the desired height, thereby reducing the width of the burr which positions a semiconductor element on the end surface of the heat sink. CONSTITUTION:The burr of the end surface produced by pressing a heat sink is intentionally increased in height higher than several tens mum, thereby forming a burr 7a for positioning. A heat sink 7 is superposed via a solder pellet 3 on a conductor 2 of an insulating plate 1 as prescribed, a semiconductor element 5 is superposed via a solder pellet on the burr 7a, the solder is reflowed through a hydrogen furnace and integrated. At this time, the element 5 is not extended from the heat sink 7 by the burr 7a. According to this structure, the heat sink 7 can be reduced in size, and the size of a semiconductor device can also be reduced.</p> |
