| 摘要 |
PURPOSE:To manufacture easily a product absorbing unevenness held by an IC or the like, by laminating thermoplastic synthetic resin sheets on the surface of a center core holding the IC or the like as intermediate layers through a bonding agent and heating and pressing these sheets. CONSTITUTION:An IC or LSI 21 is held on the center core 11 made of a thermoplastic synthetic resin, e.g. rigid vinyl chloride. A wiring pattern 23 of the IC 21 or the like causes unevenness 22. The thermoplastic synthetic resin sheets 15 made of rigid vinyl chloride are laminated through a bonding agent layer 16 consisting of a heat-reactive type vinyl acetate resin or the like. These laminated sheets are heated and pressed for 5-10min at 60-120 deg.C temperature and 10- 25kg/cm<2> pressure. Subsequently, an oversheet 12 forming a picture on the back by printing or the like is superposed to the card absorbing the unevenness on the surface of the IC or the like through a bonding agent 13 having the same quality as the bonding agent layer 16. The transparent rigid vinyl chloride is used as the material of the oversheet 12. Thus, the card with the smooth surface can be easily produced in high yield. |
