发明名称 DRY ETCHING DEVICE
摘要 PURPOSE:To bring a material to be etched thermally into contact with a cathode cooled by water while enabling excellent etching without degrading a resist at all by setting up a mechanical hold-down member for the material to be etched. CONSTITUTION:A stepped difference 29 is formed between a cathode section 31 just under the material to be etched 28 and the peripheral section 32 of the section 31 in the cathode 25, which is cooled by water and to which high-frequency power 22 is applied. Consequently, the strength of holding-down is sufficient for thermally bringing the material to be etched into contact with the cathode by the thickness of the stepped difference section even when the thickness of contact sections 33a, 33b with the material to be etched of the hold-down member 23 for the material to be etched is thin as 1- 2mm.. When height up to the surface of the cathode from a magnet assembly is made 8mm., the thickness of 32 and 29 is each 5.5mm. and 3mm. when the thickness of the material to be etched is made 0.5mm., and the whole thickness of the hold-down plate can be taken by 5.5mm. when 33a and 33b are made 2mm.. Accordingly, an allowance on processing through which not only a cathode plate but also hold-down plate itself can be cooled by water is generated, and the reduction of the chucking force of the material to be etched due to a warpage by the temperature rises of 33a and 33b during discharge and the degradation of the resist are prevented.
申请公布号 JPS5913327(A) 申请公布日期 1984.01.24
申请号 JP19820122104 申请日期 1982.07.15
申请人 TOKYO SHIBAURA DENKI KK 发明人 OKANO HARUO;YAMAZAKI TAKASHI;HORIIKE YASUHIRO
分类号 H01L21/302;H01J37/34;H01L21/3065;(IPC1-7):01L21/302 主分类号 H01L21/302
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