| 摘要 |
PURPOSE:To prevent exfoliation by the heat of first and second Al layers by forming an insulating film for a buffer in a junction just under a bonding pad section, isolating both Al layers and joining both Al layers in sections separating at predetermined distances from the bonding pad section regarding both Al layers. CONSTITUTION:Both the first Al 3 formed on an IC chip substrate 1 and the second Al layer 5 bonded with the first Al layer are constituted through a buffer film 4' of excellent adhesive property with aluminum in an adjacent section F containing the bonding pad section 6a in the first Al layer 3 and the second Al layer 5. Both Al layers 3, 5 are bonded in a region s hardly affected by heat in case of bonding because they separate at the predetermined distances such as approximately 10mum from the bonding pad section 6a. Accordingly, an insulating film 4 which has been used is combined as the buffer film 4' and used, thus substantially equalizing pad structure with single layer structure, then largely displaying an effect as the prevention of exfoliation in case of bonding. |
