| 摘要 |
PURPOSE:To reduce power supply wirings, and to alleviate the complication of wiring with an increase of the number of mount while also preventing the vanishing of written informations at the time of trouble by setting up an independent power supply having self-electromotive force, such as a mercury cell, a storage battery, etc. to the inside or outer surface of a package and supplying a semiconductor chip with power. CONSTITUTION:The LSI semiconductor chip 2 is sealed in the package 1 in an airtight manner, and a large number of bonding pads 3, which are connected to an internal circuit and formed, are formed to the surface of the semiconductor chip 2. The mercury cell 5 is incorporated into the package 1, and a positive electrode 61 for taking power and a negative electrode 62 are formed to the mercury cell. A ground pin 4' is connected to both the terminal 3' of a ground wiring layer formed to the semiconductor chip 1 through a bonding wire 7 and the negative electrode 62 of the mercury cell 5. On the other hand, the terminal 3'' of a power supply wiring layer formed to the semiconductor chip 1 is connected to the positive electrode 61 of the mercury cell 5 through a bonding wire 7. |
