| 摘要 |
PURPOSE:To prevent electrostatic breakdown before mounting effectively, and to operate the device normally at mounting by grounding at least one part of leads in the semiconductor device packaged through a member, which can be interrupted electrically, on mounting. CONSTITUTION:Fuses 6 are connected to bonding lines 5 connecting the leads 2... and bonding pads 4..., and the fuses 6 are grounded. The fuses 6 are grounded previously by being connected to a substrate region of a device such as a semiconductor chip 3. Consequently, even when electrostatic noises enter from the outside through the leads 2..., electrostatic noises are not applied to the internal circuit of the semiconductor chip 3 because the leads 2... are grounded through the fuses 6..., thus generating no electrostatic breakdown under the state before mount. When mounting is completed and the device is used actually, currents are flowed through the fuses 6 for melting it. |
