| 摘要 |
PURPOSE:To prevent the scattering of the wafer even by revolution at high speed on the revolution for application, and to improve the accuracy of the formation of a pattern by providing a centering mechanism conforming the central point of the wafer and an axis of rotation of a chuck proper, an orientation-flat position regulating mechanism regulating the position of an orientation flat at a fixed position, and a moving mechanism conforming a point of the center of gravity and an axis of rotation. CONSTITUTION:When the wafer 4 is held under a centered state, the moving mechanism 18 is operated, and the wafer 4 is moved toward the orientation flat 9 through the centering mechanism 16 at a fixed distance. Accordingly, the state in which a point of the center of gravity of the wafer 4 and an axis of rotation 10 agree is brought. The wafer 4 is adsorbed to a holding surface again, is positioned at the position of a rise for a fixed time, and drops. A motor is turned at the fixed speed of rotation for a fixed time, a resist being dripped previously spreads, and a film of predetermined thickness is obtained. The time, order and positions of the operation of each mechanism are regulated by a regulating section for positioning and an application control section. |
