| 摘要 |
PURPOSE:To simplify the selection as well as to contrive improvement in workability of the titled semiconductor device by a method wherein a marking process is performed on the rejected chips using marking agent for magnetic section, said marking agent for magnetic selection is hardened, and then wafers are cut for each chip. CONSTITUTION:The functions of each semiconductor element is inspected using an inspection machine 12, and a marking agent is applied to a rejected semiconductor chip 3 using a marking device 13. Ferromagnetic photo curing ink is used as the marking agent. Then, a wafer is placed below a light-generating device 15, and the ink is hardened. Subsequently, after the semiconductor substrate has been separated by cutting into semiconductor element chips 10 using a cutter 14, acceptable semiconductor element chips 4 and rejected semiconductor element chips 3 are placed on a belt 11 respectively, they are conveyed and the rejected semiconductor element chips 3 are removed using a magnet 8. |
