| 摘要 |
PURPOSE:To permit a semiconductor product to be automatically manufactured, fabricated or inspected, by automatically reading an identification mark put to a semiconductor product in a non-contact manner, and subjecting the semiconductor product to a necessary treatment according to the reading result. CONSTITUTION:A wafer 1 provided with a necessary identification mark (identification data) 2 is fed to a predetermined position. The identification mark 2 on the wafer 1 is scanned with a laser beam from a laser beam generator 3 constituting a reading apparatus, and the laser beam reflected from the identification mark 2 is received by a light-receiving device 4. The result is subjected to pattern recognition by a pattern recognition device 5 to optically and automatically read data from each identification mark 2, e.g., the product type name, the mask version and so forth, thereby to distinguish between the contents of the data. The pattern recognition device 5 constituting the reading apparatus stores into a memory device 7a necessary data representing a treating process about the wafer 1. A selected treating device 6 applies a necessary treatment to the wafer 1 according to a command from the reading apparatus. |
