| 摘要 |
PURPOSE:To enable to manufacture the semiconductor stack in a small type and at low cost by a method wherein the heat radiating area of heat sinks interposing elements between them are made smaller in proportion to be closer by a cooling means. CONSTITUTION:The semiconductor elements 4a-4f are interposed between the heat sinks 5a-5g. Because the heat sinks 5a-5g are cooled more eaisly in proportion to be closer by the fan 6, width D is made smaller to reduce the heat radiating area, and the elements 4a-4g are held at the allowable temperature or less when cooled by the fan 6. By making widths D of the heat sinks interposing the respective elements between them like this to be smaller in proportion as it approaches the fan 6, the stack can be prevented from formation in a large type due to the unnecessarily large size of heat sinks. |
