| 摘要 |
PURPOSE:To obtain a radiator header which enables the improvement in the appearance of a semiconductor device and unnecessitates deburring work, by forming a recessed part on a base exposed out of a resin-sealed body. CONSTITUTION:A thick plate material of copper is blanked into a header member 1 by using a first metal die 11. A burr 3 and a droop 4 are formed on the occasion. Then, a recessed part 9 is formed on the surface of the header member 1 whereon the droop 4 is formed, by using a second metal die 12. The surface with the burr 3 being directed upward, a semiconductor 6 is connected to the header member 1, and the electrodes of the element are connected to leads 7 by gold wires 8. The header 1 is put in molding dies, molding is made by using epoxy resin or the like, and thereby a resin-sealed body 2 is formed. Since the surrounding resin body 2 is in partial contact with the header in the vicinity of the droop 4, the surfae pressure in the part is increased. Thereby the burring is prevented, and simultaneously the leak of resin can be prevented. |
