发明名称 CHIP FOR EVALUATING ALUMINUM WIRING PERFORMANCE OF SEMICONDUCTOR DEVICE
摘要 <p>PURPOSE:To accurately detect the width of valley portions in the structure including the mounds and valleys, namely the length of valley portion by juxtaposing on a substate, a plurality of pairs of aluminium wirings having the irregular structure including the mounds and valleys and forming the valleys of each wiring in different lengths. CONSTITUTION:Since poly-silicon layers 4... are inclined (not in parallel) in the shape of ? at both sides of the trunk part 5a of aluminum wiring, an interval between the mounds (M) formed by the poly-silicon layer 4, namely the width lof valley (V) (length of valley portion in the aluminum wiring) is different for each branch 5b. The width of the lower half of valley is generally longer than the width of the valley of the upper half. Moreover, the width l of the valley is formed in any case so that it gradually becomes larger from the left to the right. Therefore, regarding the pads A1-A14 which are provided as the output terminals, a value of the branch becomes larger as the number given to A becomes large. After the aluminum wiring is formed, a chip for evaluation can be obtained through the sealing by the sealing resin.</p>
申请公布号 JPS5910234(A) 申请公布日期 1984.01.19
申请号 JP19820120011 申请日期 1982.07.10
申请人 MATSUSHITA DENKO KK 发明人 HASHIZUME JIROU
分类号 H01L23/52;H01L21/306;H01L21/3205 主分类号 H01L23/52
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