发明名称 METHOD OF PRODUCING MULTILAYER CIRCUIT BOARD
摘要 A method for manufacturing the insulating layers of a glass multilayer wiring board from a mixture of (1) 30-90 wt. % of a borosilicate glass consisting of 55-75 wt. % of SiO2, 13-25 wt. % of B2O3, 5-13 wt. % of Al2O3, each 1-5 wt. % of PbO, MgO, and BaO, and each 1-2 wt. % of Na2O and K2O and (2) 70-10 wt. % of a silica glass, is provided.
申请公布号 JPS599992(A) 申请公布日期 1984.01.19
申请号 JP19820117765 申请日期 1982.07.08
申请人 HITACHI SEISAKUSHO KK 发明人 TOZAKI HIROMI;TANEI HEIKICHI;NORO TAKANOBU;IKEGAMI AKIRA;SUGISHITA NOBUYUKI
分类号 H05K3/46;C03C3/108;H01L21/48;H01L23/538;H05K1/00;H05K1/03 主分类号 H05K3/46
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