| 摘要 |
PURPOSE:To realize a variety of resin sealing in accordance with purposes by molding the resin except for semiconductor elements placed on the tab part and the upper part of conductor and thereafter sealing the device with the resin different from that used for resin molding. CONSTITUTION:A tab part 11 is bonded to the rear surface of a lead frame 12 through an electrically insulated layer 17 formed like a frame. Next, a semiconductor element 13 is fixed to the tab part 11 using a metal brazing material 14, and a semiconductor element and an internal lead are connected with a conductor, bonding wire 15. Thereafter, the lead frame 12 on which semiconductor elements are already placed is arranged to the specified position of the bottom force 18b of the mold, the top force 18a and the bottom force 18b are tightened, the mold resin 16 is supplied from the gate portion 19, thereby the resin is hardened. Thereafter, the semiconductor element 13 and the bonding wire 15 are previously sealed and external wording is carried out. |
