| 摘要 |
PURPOSE:To realize multi-pin element without increasing the size of package and simultaneously reduce wiring resistance and wiring capacitance by providing the bump for external elecrode to both upper and lower surfaces of package. CONSTITUTION:A bump 2 for external lead is extracted to both upper and lower surfaces of package directly from the region 4 used as the internal lead pattern. The external lead bump can be extracted from desired position, other than the island, cap, and bonding stitch. Thereby, the internal lead 3 can be shortened and wiring resistance and wiring capacitance can also be reduced. Since the external lead bumps 2, 5 are provided in both sides, a number of pins can be increased up to two times under the same area as compared with the conventional plug-in type package or up to several times as compared with DIP and flat package. |
