Multilayer wiring structure

摘要

A multilayer wiring structure comprising a plurality of groups of patterns each having a multiplicity of wirings formed on the opposite sides of an intervening insulation film. The intervening insulation film is formed with a void exposed to both an upper pattern of a multiplicity of wirings and a lower pattern of a multiplicity of wirings, the upper and lower patterns being formed on and beneath the intervening insulation film and arranged to form a matrix. The void extends longitudinally across one of the patterns, and the upper and lower patterns are connected together through the void at crossing points of the matrix.