| 摘要 |
A high density dimensionally stable encapsulated circuit board and a method of making such a board is described. A curable adhesive is utilized to bond insulated wires to a substrate, the dimensional stability of which is maintained by a sheet of relatively thick copper foil. Since the adhesive sis cured and since the copper foil returns to the same dimensions when thermally, mechanically or chemically cycled, the entire composite is dimensionally stable. As shown the board comprises two thick copper foils 20, 21, three epoxy resin pre-preg layers 22, 23, 24 and two cured adhesive layers 41, 42 in which wires are embedded. At each location where a connection is to be made to a wire, the wires has a non linear U-shaped portion. The increased dimensional stability plus U-shaped portion of the wires allows connections to be made to the board utilizing a very small drill. The result is a high density stable circuit board. Clearance holes 11 are formed in the copper layers 20, 21 and smaller holes 70 are drilled to register with the U-shaped portions of the wires and are through plated. |
