| 摘要 |
PURPOSE:To enable dry type development using no developing soln., by selectively removing unexposed or exposed areas by blowing abrasive particles against a photosensitive resin layer imagewise exposed. CONSTITUTION:A photosensitive resin layer is formed on a base of a metal, plastics, glass, or the like, and imagewise exposed. As this resin, a resin solid at room temp. and causing great change in tensile strength before and after the exposure is advantageous, and a photosensitive resin compsn. consisting of a linear polymer, an ethylenically unsatd. compd., and a photopolymn. initiator is preferable. After the exposure, abrasive particles, such as diamond or alundum, is jetting forcibly at 1-10kg/cm<2> against the resin layer to remove the unexposed or exposed areas 2 selectively. An image corresponding to the pattern can be engraved on the surface of the base. |
