| 摘要 |
PURPOSE:To grind an outside peripheral part of a semiconductor element with high accuracy and speedily, by correcting only software in response to variations in dimensions of a highly pressure-resistant semiconductor element and wear and tear of a grinding wheel, without using any positioning sensor. CONSTITUTION:A cup from grinding wheel 12 which is electrically conductive is fitted to an end of a spindle 9 provided on a spindle table 1. A vacuum attracting mechanism C used as a retaining mechanism is connected to an end part of the spindle 24 to retain a work W, that is, a disk form semiconductor element. Further, a contact-detecting circuit 28 consisting of a contact-discriminating circuit is electrically connected between blocks 10 and 25. A peripheral surface machining device is processed in a software manner on the basis of a reference position detected by the circuit 28 or the like, and can be quickly adjusted in response to variations in the finished dimensions of the work W and wear and tear of the grinding wheel 12, so that the peripheral part of the work W can be ground with high accuracy and speedily. |
