发明名称 QUALITY INSPECTING METHOD FOR RESIN-SEALED AND MOLDED SEMICONDUCTOR AND LEAD FRAME FOR INSPECTING QUALITY
摘要 PURPOSE:To improve the inspecting accuracy and the production efficiency by forming a quality inspecting hole formed at a lead frame between a light source and a photoelectric converter opposed to the source, receiving a passed light and operating a detecting mechanism by utilizing the photoelectric conversion output. CONSTITUTION:When molten resin is filled under the prescribed pressure in a cavity of resin molding die, a resin piece 12a is produced in the dam 4 of a lead frame, but when the pressure is insufficient, the dam 4 becomes open state, the light of a light source 14 passes through the dam 4, is received by a photoelectric converter 16, and a detecting mechanism 17 is operated by the output of the converter 16. In case of a mold which does not produce the resin piece 12 in any of the dam 4a between the leads 2, an exclusively inspecting resin piece molding unit 26 is formed at the stem 5. When the piece 12a is molded at one of the dams 4 or a resin piece 12b may be formed in the resin piece molding unit of the stem 5 in this manner, a light source and a photoelectric converter can be reduced in side, both are approached, and the quality can be inspected accurately.
申请公布号 JPS58204544(A) 申请公布日期 1983.11.29
申请号 JP19820088480 申请日期 1982.05.24
申请人 OSADA MICHIO;BANDOU KAZUO 发明人 OSADA MICHIO;BANDOU KAZUO
分类号 H01L21/66;H01L21/56;H01L23/48;H01L23/50 主分类号 H01L21/66
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