| 摘要 |
PURPOSE:To correct automatically discrepancy of the contact positions of the multipin prober by a method wherein the multipin prober is held continuously so as to perform thermal expansion and contraction the same with a circuit substrate to be inspected when the inspection of the circuit substrate is performed. CONSTITUTION:The circuit substrate 5 to be inspected is guided by an initially positioning guide pin 2 to be set to an inspection fixture main body 1, and the initial position thereof is decided. By exhausting air inside by a vacuum pump through a suction duct 4, probing pads 7 and the spring contact pins 9 are made to come in contact mutually. At this time, when an electric power source is closed to the circuit substrate 5 to be inspected, and the inspection is started, according to generation of heat of loaded elements 6, the circuit substrate 5 to be inspected generates thermal expansion in accordance with the substrate temperature. The temperature of the circuit substrate 5 to be inspected and the prober 8 are measured respectively by a temperature sensor 10 for the circuit substrate to be inspected and a temperature sensor 11 for the prober, the result thereof is processed by a thermal expansion and contraction control unit 13, and by controlling a heating and cooling apparatus 12 as to make respective thermal expansions and contractions to become to the equal quantities, thereby the discrepancy of the contact positions of the probing pads 7 and the spring contact pins 9 can be prevented. |
