发明名称 |
METHOD FOR SPUTTERING BOTH SURFACES AND SUPPORTING JIG |
摘要 |
PURPOSE:To simultaneously form a uniform sputter film on both front and back surfaces of an object to be treated in good efficiency, by a method wherein the object to be treated is held by a holder so as to expose both surfaces thereof and sputtering is carried out while the holder is rotated. CONSTITUTION:Plural objects to be treated such as bar shaped chip groups 25 are arranged in the framework 9 of a holder 7 and clamped by a clamp bolt 12 to hold the plural bar shaped chip groups 25 which are in turn attached in a sputter treating chamber. A motor 17 is rotated to rotate the framework 9 by a revolving mechanism 8 and sputtering is carried out to coat the emitting surface of the front and the back surfaces of each bar shaped chip group 25 with a sputter film. By this method, working efficiency is enhanced and irregularity in characteristics is reduced to enhance yield. |
申请公布号 |
JPS596373(A) |
申请公布日期 |
1984.01.13 |
申请号 |
JP19820113905 |
申请日期 |
1982.07.02 |
申请人 |
HITACHI SEISAKUSHO KK |
发明人 |
SATOU AKIHIKO;SHIGIYOU YOSHIHARU;TAKEI ICHIROU;INABA KEIZOU;OGIWARA SEIICHIROU |
分类号 |
C23C14/34;C23C14/50;H01L21/285;H01L21/31;H01S5/00;H01S5/028 |
主分类号 |
C23C14/34 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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