| 摘要 |
PURPOSE:To provide the titled apparatus constituted so as to scatter a vapor deposition source to an arbitrary direction in a bundled form, by providing a means mutually applying an AC electric field to a vapor deposition source in a direction crossing both fields at right angles and in the same phase. CONSTITUTION:Electrodes 2, 3 are arranged in opposed relation to each other so as to hold a vapor deposition source 1 therebetween and an AC power source 4 for generating an electric field is connected to the electrodes 2, 3. Electromagnets 5, 6 are arranged in opposed relationship in a direction crossing the opposed direction of the electrodes 2, 3 at right angles and an AC power source 7 for generating a magnetic field is connected to the electromagnets 5, 6. To the vapor deposition source 1, the electric field due to the electrodes 2, 3 and the magnetic field due to the electromagnets 5, 6 in the direction crossing the above mentioned electric field are respectively applied. In this case, the frequencies of both power sources 4, 7 are made equal and the electric field and the magnetic field are applied to the vapor deposition source 1 in the same phase. By this method, the vapor deposition source 1 can be scattered to an upward direction in a bundled form and a vapor deposition film can be formed on a substrate in good efficiency. |
