| 摘要 |
PURPOSE:To enable automatic treatment of a substrate by conducting a necessary treatment to a wafer or a pellet on the basis of the results of the automatically read identification marks on the wafer or the pellet. CONSTITUTION:A wafer 1 with a required identification mark 2 on is fed to a pre-determined position, and set on a position where automatic reading of the identification mark 2 by a reader 3 on the basis of an orientation flat 1a is possible. In this state, each probe 4 of the reader 3 contacts with each identification mark 2, reads automatically the data from each identification mark 2, such as the name of the model of a product and mask version on the basis of a binary digit, and identifies the content. According to the result of the reading and the identification what to operate next is decided, and the reader 3 selects a treatment apparatus 5 and commands the treatment apparatus 5 to conduct a required manufacture or process or inspection to the wafer 1. The treatment apparatus 5 conducts the required treatment to the wafer 1 according to the command from the reader 3, and after that the wafer 1 is sent to a next step. |
