发明名称 HYBRID INTEGRATED CIRCUIT
摘要 PURPOSE:To contrive not to generate the exfoliation of a conductor part from an insulation substrate, even when external wiring lead wires are fixed in the rectangular direction to the conductor part, by a method wherein an external wiring connection part is divided into a plurality of connection parts, and various kind of stresses from the outside are concentrated to one of the divided connection parts. CONSTITUTION:The external wiring connection part 2a of a conductor part 2 is divided into two connection parts 2a-1 and 2a-2. After the connection part 3a of an external lead wire 3 is connected to these connection parts 2a-1 and 2a-2, in the same manner as conventional, with solder, it is bent at a right angle, resulting in the formation of a hybrid integrated circuit. Therefore, in a hybrid integrated circuit of such a structure, even when stress in rectangular direction to the conductor part 2 is applied by the external wiring lead wire 3, the stress becomes to concentrate to the connection part 2a-2, and therefore the stress to the conductor part 2 including the connection part 2a-1 is relaxed. As a result, the accident that the conductor part 2 exfoliates from the insultion substrate 1 can be prevented, and thus the improvement of the reliability can be contrived.
申请公布号 JPS596567(A) 申请公布日期 1984.01.13
申请号 JP19820115943 申请日期 1982.07.02
申请人 MITSUBISHI DENKI KK 发明人 KOBAYASHI EIJI
分类号 H01L23/50;H01L23/498;H05K1/11;H05K3/34 主分类号 H01L23/50
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