| 摘要 |
PURPOSE:To simplify the soldering work and improve the workability and thus facilitate the automation by a method wherein an electronic component is soldered collectively to a conductor on an insulation substrate after provisionally fixing an external lead wire to the electronic component. CONSTITUTION:After a power semiconductor element 1 and a head sink 2 are soldered, the external lead wire 5a is provisionally fixed to the side surface of the heat sink 2 by means of welding, etc. Next, after reserve soldering is performed to the conductor layer 4, the heat sink 2 is placed on the conductor layer 4, resulting in reflow of the solder, and then a hybrid integrated circuit is formed by soldering collectively to the conductor layer 4 together with the external lead wire 5a. |
