发明名称 MAGNETRON SPUTTERING APPARATUS
摘要 PURPOSE:To provide a magnetron sputtering apparatus enlarged in the available utilizing region of a target, by making the mutual positional relation of a pair of magnets arranged in the vicinity of the surface of a cathode target opposed to an anode variable. CONSTITUTION:A pair or more of magnets 6a, 6b of which mutually different magnetic pole surfaces are directed to an anode are arranged in the vicinity of the surface of a cathode target 2 opposed to the anode arranged in a vacuum container. These magnets 6a, 6b for generating magnetic fields are formed into a mutually movable structure or at leastone of each pair of the magnets 6a, 6b is made exchangeable with a magnet different in a size. By this method, sputtered regions 9, 9' are enlarged and the usable time of the same target 2 can be prolonged. In addition, the structural irregularity of a product can be suppressed.
申请公布号 JPS596377(A) 申请公布日期 1984.01.13
申请号 JP19820115539 申请日期 1982.07.05
申请人 TOUHOKU KINZOKU KOGYO KK 发明人 HAJI YUUJI
分类号 C23C14/35;C23C14/36;H01J37/34 主分类号 C23C14/35
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