Multiple level circuit and a method for its production

摘要

A multiple level circuit consists of a stack of ceramic substrates which in each case have a structure comprising a conductor and/or resistor layer. Structures in different levels can be connected to one another by means of conductor tracks which run in the stack direction through through-plated holes in the individual substrates. In order to increase the packing density and to improve the vibration insensitivity, it is proposed to connect the individual substrates to one another, at a distance from one another, in such a manner that this leads to a connection which can not be detached without destruction. This connection is produced using either an electrically insulating, mechanically connecting, intermediate layer which fills the distance between the levels, and/or an electrically conductive and mechanically connecting conductor bridge which is provided between at least two through-plated holes or regions plated around the substrates, which are located one above the other in the stack.