| 摘要 |
PURPOSE:To widen temperature range in which stable operation is obtained, by changing mechanically inclination of a base plate to a bias magnet and a homogenizer according to temperature change utilizing difference of the thermal expansion coefficient of two kinds of molding resin largely different in the thermal expansion coefficient. CONSTITUTION:After mounting a magnetic bubble chip 12 on a base plate 11, the chip 12 and the terminal of the base plate 11 is bonded with a wire 15. An X-coil 16 and a Y-coil 17, intersecting at right angles, are fixed into the base plate 11, and the base plate 11 is fixed through a lead wire 19. Silicone resin 13 and epoxy resin 14 are inserted in the periphery of the base plate 11 in a frame 18. Before hardening, a homogenizer 20 having small holding power and magnetically soft, and a bias magnet 21 are attached above and below the base plate 11, and each resin 13, 14 is heat cured to complete a device fixed to a shield case 22. Since the thermal expansion coefficients of resin 13, 14 are different, inclination of the base plate 11 changes with temperature, and range of stable operation is widened. |
