| 摘要 |
PURPOSE:To miniaturize a coil, by utilizing a part of a base plate which is a main cause to enlarge the coil, as a part of the coil. CONSTITUTION:A magnetic bubble chip 11 is mounted on a wiring base plate 12 and through holes 13 that penetrate the base plate 12 are provided. Pads 14 for soldering are provided above and below. A strand 15 that is refered to a part of a coil is connected to the pads 14 to cover the chip 11. A strand 16 is connected on the opposite side, and a coil is formed by a strands 15 and 16 and through holes 13. This process is repeated, and an X-coil 81 and a Y-coil 82 are formed. As coils 81, 82 are formed through the base plate 12 (2), coils 81, 82 can be miniaturized without influenced by the size of the base plate. |
