发明名称 A plastics-encapsulated circuit element.
摘要 <p>A high voltage circuit element (16) is connected with a number of external leads (19, 21, 22) which are close to one another. The assembly is enclosed in a plastic encapsulation (26), the surface of which is stepped (28) between adjacent leads (19, 21 and 21, 22) in order to increase the surface path between the leads.</p>
申请公布号 EP0098051(A2) 申请公布日期 1984.01.11
申请号 EP19830303116 申请日期 1983.05.31
申请人 KABUSHIKI KAISHA TOSHIBA 发明人 YASUI, MITSURU C/O PATENT DIVISION
分类号 H01L23/48;H01L23/28;H01L23/31;H01L23/495;(IPC1-7):01L23/30 主分类号 H01L23/48
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