发明名称 SOLDERING OF TERMINAL
摘要 PURPOSE:To limit the quantity of supply of solder to necessary quantity and limit timing of supply to necessary time and eliminate futile consumption by focusing infrared rays for heating to a limited part utilizing a mirror reflecting plate, and performing local heating and melting of solder. CONSTITUTION:When a combined body of a base plate (a) and a terminal (c) is sent to preheating position, heating light from a preheating lamp 1 is focused to a target position of soldering, and the target position is heated consistently to a specified temperature. On arrival at soldering position, solder coming out from a nozzle 3 is molten by focused heat source of a soldering lamp 6 and the solder adheres to intended part of soldering preheated to facilitate adhering of solder, and the base plate (a) and terminal (c) are soldered. Solder required for one time of soldering is sent out by a feeding device that synchronizes with the operation of unnecessary terminal cutting device, and timing of operation is given by electric signal from an unnecessary terminal curring device.
申请公布号 JPS594966(A) 申请公布日期 1984.01.11
申请号 JP19820113460 申请日期 1982.06.30
申请人 SHII KEE DEI KK 发明人 UESAWA MASUMI;KOUSHI KIYOHIKO
分类号 H05K3/34;B23K1/00;B23K1/005;H01L23/50 主分类号 H05K3/34
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