Leadless chip carrier semiconductor integrated circuit device.

摘要

In a leadless chip carrier (LCC) type semiconductor device, a larger number of soldering pads (3, 8) for connection to an external circuit can be formed for a given package size by using different depths of adjacent grooves (611a, 611b, 621a, 621b) formed along the edge face (612, 622) of the package to receive metallization lines (613a, 613b, 623a, 623b). Adjacent soldering pads are therefore located at different depths from the periphery of the package, so that the risk of short circuits caused by solder bridges between adjacent soldering pads is not increased by the increased density.