发明名称 PACKAGE FOR SEMICONDUCTOR DEVICE
摘要 PURPOSE:To enable to prevent the production of a parasitic capacity by placing a dielectric substrate and an electric terminal base on the same plane, thereby eliminating the stepwise diffeence of both. CONSTITUTION:An electric terminal 4 has a dielectric base 4A which has the same thickness as a dielectric substrate 3, and a electric piece 4B which is integrated with the base 4A provided in the vicinity of the laminated part 67 of a metallized film of the base 4A, and placed fixedly on the same surface as the surface, to which the substrate 3 is secured. The substrate 3 and the terminal 4 are provided on the same surface of a metal base 1, and since there is no stepwise difference therebetween, no parasitic capacity is produced. Accordingly, it can exhibit excellent high frequency characteristics even in the frequency equal to or higher than Ku band.
申请公布号 JPS594146(A) 申请公布日期 1984.01.10
申请号 JP19820113254 申请日期 1982.06.30
申请人 FUJITSU KK 发明人 HIDAKA NORIO
分类号 H01L23/12;H01L23/66 主分类号 H01L23/12
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