| 摘要 |
A clamp for securing and electrically connecting an object to be electroplated to an electroplating rack for immersion in an electroplating solution, electrical contact being made between the rack and the object. The clamp includes a frame including a conductive core and an insulating sheath thereover. An opening in the frame has a threaded electrically conductive portion and at least one unthreaded electrically insulating end portion. A clamp screw is provided, having an actuating head, a clamp face, and a threaded central electrically conductive shank portion intermediate the clamp face and actuating head and spaced therefrom and adapted to engage the threaded electrically conductive portion of the frame opening. The screw has at least one shank portion contiguous with and flanking the central portion which is unthreaded, the unthreaded shank portion and the unthreaded end portion of the frame opening being dimensioned for a surface-to-surface substantially liquid-tight interference fit, to provide therebetween a relatively liquid-tight seal, whereby significant quantities of electroplating solution is prevented from reaching the threaded electrically conductive shank and frame portions, the clamp face including a conductive face portion for contacting the item to be electroplated. The conductive portion of the clamp face is internally conductively connected with the threaded screw shank portion. A conductive clamp pad is provided flush with the outer insulating sheath of the frame and opposite the clamp face of the screw between which the object to be electrically engaged and clamped is positioned.
|
