| 摘要 |
PURPOSE:To provide an input/output terminal which has extremely small power loss and power reflection even in frequencies equal to or higher than an X band by composing to couple the ground conductor film of a strip line to a semiconductor chip placing unit at the shortest distance in a package for a semiconductor device used in ultrahigh frequency band, thereby preventing the production of a parasitic element. CONSTITUTION:An oblique surface 1B is formed by cutting the edge side of the upper surface of a raised semiconductor chip placing unit 1A. An inside conductor film 12 which is integrated with a ground conductor film 8 is formed on the inside surface of the first frame 6 by the same technique as the film 8, a gold- plated copper wire 13 which has approx. 0.1-0.3(mm.) of diameter and approx. 3(mm.) of length is placed between the lower part of the surface 1B and the film 12, and low melting point solder 14 such as gold-tin or the like is flowed thereto, thereby coupling them. Accordingly, the film 8 can be coupled to the upper surface of the chip placing unit 1A at the electrically shortest distance. |
