发明名称 |
Hole cleaning process for printed circuit boards using permanganate and caustic treating solutions |
摘要 |
An improved process for removing resin smeared on an interior wall of a hole in a resinous substrate and/or adhesion promoting the substrate which comprises: (a) contacting the substrate with an alkaline permanganate treating solution having a pH between about 11 and about 13 and an elevated temperature for a time period sufficient to remove the resin smear; (b) neutralizing essentially all manganese residue on the substrate; (c) contacting the substrate with an alkaline hydroxide etchant to remove the balance of manganese residue on the substrate. A metal such as copper subsequently may be electrolessly deposited in a more efficient and easily controlled manner on the resin substrate in the formation of a wire scribed circuit board or multilayer printed circuit board. In addition to resin smear removal, the process results in an improved bond between copper and the hole wall.
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申请公布号 |
US4425380(A) |
申请公布日期 |
1984.01.10 |
申请号 |
US19820443160 |
申请日期 |
1982.11.19 |
申请人 |
KOLLMORGEN TECHNOLOGIES CORPORATION |
发明人 |
NUZZI, FRANCIS J.;DUFFY, JOHN K. |
分类号 |
H05K3/46;H05K3/00;H05K3/18;H05K3/26;(IPC1-7):B05D5/12;B05D3/04;B29C17/08;B44C1/22 |
主分类号 |
H05K3/46 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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